Submit a Paper

Scope and Objectives

The aim of International Workshop on Mobile Applications (MobiApps 2024) is to foster interaction of researchers, exchange of new ideas, and to enhance communication between academia and industry in the area of Mobile Applications. MobiApps-2024 is co-located with The The 11th International Conference on Future Internet of Things and Cloud (FiCloud 2024) and the 20th International Conference on Mobile Web and Intelligent Information Systems (MobiWIS 2024)

Previous Conferences Past Papers

2023 Papers on IEEEXplore 2022 Papers on IEEEXplore 2021 Papers on IEEEXplore 2019 Papers on IEEEXplore 2018 Papers on IEEEXplore 2017 Papers on IEEEXplore 2016 Papers on IEEEXplore 2015 Papers on IEEEXplore 2014 Papers on IEEEXplore

The Workshop topics include (but are not limited to) the following:

Mobile Applications Architecture and Design

Mobile Applications Implementation and Development

Location-aware Mobile Applications

Collaborative Mobile Applications

M-Services: M-Heath, M-Government M-Learning

Mobile Applications for the IoT

Mobile Application Security

Mobile Applications for Vehicular Technology

Machine Learning for Mobile Appications

INSTRUCTIONS FOR AUTHORS:

You are invited to submit original and unpublished research works on above and other topics related to Mobile Applications. Submitted papers must not have been published or simultaneously submitted elsewhere. Please, indicate clearly the corresponding author and include up to 6 keywords and an abstract of no more than 400 words. Papers must be formatted according to CPS format; see formatting instructions and stylesheets. Submitted research papers may not overlap with papers that have already been published or that are simultaneously submitted to a journal or a conference with proceedings. Each paper will receive a minimum of three reviews. Papers will be selected based on their originality, relevance, contributions, technical clarity and presentation. Submission implies the willingness of at least one of the authors to register and present the paper, if accepted. Authors of accepted papers must guarantee that their papers will be registered and presented at the workshop. Workshop proceedings would be published in IEEE Computer Society's Conference Publishing Services.

  • Submission Deadline: 1 May, 2024

  • Authors Notification: 20 May, 2024

  • Final Manuscript Due: 10 June, 2024

PAPER SUBMISSIONS:

Authors are requested to submit their papers electronically using the Online EDAS conference management system in PDF format before the deadline (see Important Dates). The submission processes will be managed by EDAS. If you have used this system before, you can use the same username and password. If this is your first time using EDAS, you will need to register for an account by clicking "create a new account" button. Upon completion of registration, you will get a notification email from the system and you are ready for submitting your paper. You can upload and re-upload the paper to the system by the submission due date.

Journal Publication

All accepted papers will be included in the conference proceedings published by Springer in the Lecture Notes in Computer Science (LNCS) series. Lecture Notes in Computer Science (LNCS) series is indexed by the ISI Conference Proceedings Citation Index - Science (CPCI-S), included in ISI Web of Science, EI Engineering Index (Compendex and Inspec databases), ACM Digital Library, dblp, Google Scholar, Scopus, etc. See LNCS - Information on Abstracting and Indexing

Extended versions of all the papers in MobiApps 2024 will be invited for publication in special issue on The International Journal of Computing and Digital Systems (IJCDS)

Program

Preliminary Program will be posted in FiCloud 2024 site: here .

Registration

Each accepted paper needs at least one full registration, before the camera-ready manuscript can be included in the proceedings. - Registration fees and instruction will be available here .

Workshop Chairs

Dr. Wael M El-Medany
Department Of Computer Engineering
University Of Bahrain, Bahrain
welmedany@uob.edu.bh
Dr. Samia Lucif
College of Technological Innovation
Zayed University, UAE
samia.loucif@ieee.org
Dr. Mohammed Ghazal
Electrical and Computer Engineering Department
Abu Dhabi University , UAE
mohammed.ghazal@adu.ac.ae
Dr. Mhd Saeed Sharif
School of Architecture, Computing and Engineering
University of East London, UK
s.sharif@uel.ac.uk

International Program Committee

Manu Malek, Stevens Institute of Technology, USA
Wuyi Yue, Konan University, Japan
Fatma A. Omara, Cairo University, Egypt
Vinay Kumar, Charles III University of Madrid, Spain
Mohammed Ghazal, Abu Dhabi University, UAE
Agah, Afrand, West Chester University of Pennsylvania, USA
Sasan Adibi, Royal Melbourne Institute of Technology, Australia
Joel J. P. C. Rodrigues, National Institute of Telecommunications (Inatel), Brazil
Saleh Al-Araji, Khalifa University of Science, Technology and Research, UAE
Mohamed Abdelhalim, Arab Academy of Science and Technology, Egypt
Mehran Asadi, Lincoln University, PA, USA
Wei Zhan, Texas A&M University, USA
Yuen, Kevin Kam Fung, Xi’an Jiaotong-Liverpool University, China
Abdelmajid Khelil, European Research Center, München
ENGIN ZEYDAN, Avea Technology Center, İstanbul, Turky
Mohammed Almeer, University of Bahrain, Bahrain
Fakhrul Alam, Massey University, New Zealand
Hosam El-Ocla, Lakehead University, Canada
Abdel-Hameed A Badawy, University of Maryland, USA
Liang Zhou, Nanjing University of Posts and Telecom., China
Wei Yu, Towson University, USA
Hung-Yu Wei, National Taiwan University, Taiwan
Yong Wang, Dakota State University, USA
Asmala Ahmad, Universiti Teknikal Malaysia Melaka, Malaysia
Faheem Ahmed, Thompson Rivers University, Canada
Marcelo S. Alencar, Federal University of Campina Grande, Brazil
Ahmed Abdelgawad, Central Michigan University, USA
Cong Wang, City University of Hong Kong, Hong Kong
Luca Vollero, Universita' Campus Bio-Medico (Roma), Italy
Ralph Turner, Eastern Kentucky University, USA
S. K. Niranjan, Sri Jayach College of Engineering, India
Tzu-Chieh Tsai, National Chengchi University, Taiwan
Ha Duyen Trung, Comm. Engineering Hanoi University, Vietnam
Arkaitz Zubiaga, City University of New York, USA
Anh-Vu Dinh-Duc, University of Information Technology, Vietnam
Young-Long Chen, National Taichung University, Taiwan
Salah Bourennane, Ecole Centrale Marseille Fresnel Institute, France
Jiang Bian, Biomedical Informatics University of Arkansas, USA
Tarek Bejaoui, University of Paris-Sud 11, France
Nilesh K Padhariya, Atmiya Institute of Technology and Science, India
Minh N. T. Nguyen, Vietnam National University, Vietnam
Thinagaran Perumal, University Putra Malaysia, Malaysia
Gregorio Romero, Universidad Politecnica de Madrid, Spain
Veerasamy Senthil, Madurai Kamaraj University, India
Hamid Sharif, University of Nebraska-Lincoln, USA
Tarun Kumar Sharma, Thapar University Patiala, India
Lei Shu, Guangdong University of Petrochemical Technology, China
Amitava Biswas, Cisco Systems, USA
Salman Khan, University of Bahrain, Bahrain
Mu-Song Chen, Da-Yeh University, Taiwan
Mohammad Mozumdar, California State University, USA
Ayman Abdel-Hamid, Arab Academy for Science, Technology and Maritime Transport, Egypt
S. K. Niranjan, Karnataka, India
Hani Hamdan, SUPELEC, France
Pritam Gajkumar Shah, HKBK College of Engineering, Bangalore

 

See You in Vienna, Austria.

Submit Paper